Quick Details: 4OZ, TG170, 12mil /12mil
Base Material | Fr4 TG170 |
Layer Counts | 12L |
Board Thickness | 3.2 mm |
Copper Thickness | 4OZ |
Min. Hole Size | 16mil (0.4mm) |
Min. Line Width/ Spacing | 12mil (0.3mm)/12mil (0.3mm) |
Solder mask Color | Green |
Silkscreen Color | None |
Surface Finishing | ENIG |
Min.Quantity of Order | No MOQ |
Certificate | UL, ISO 9001, ISO 14001 |
Difficulty | Heavy Copper |
