Home
/
Categories
/
Chemicals
/
Adhesives & Sealants
/
Hot Melt Adhesives
/
Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A
Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A
FOB Price
China
Main Products : PUR Hot Melt Adhesives
Changjiang South Road, No.17-17, Wuxi, jiangsu 214000, CN Wuxi, Jiangsu
Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A Details
Place of Origin
China
Supply Type
OEM Service
Condition
New
Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A Introduce

Product Description

Polyurethane hot melt glue PUR-7563A can be used for a broad spectrum of adhesion to different edgeband materials. Fast adhesive setting for direct downline processing and high heat resistance and durability. Wanli supplies these hot melt adhesives of the latest generation also in granulate form. The ease of processing makes them particularly attractive for processers who have not used the PUR technology before

Wanli® PUR hot melt adhesive PUR-7563A for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7563A is a cleaning free glue, which is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates. PUR-7563A is featured stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.

APPLICATION

Wanli® PUR hot melt adhesive PUR-7563A is used for edge bonding. PUR-7563A is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates.

Application MaterialWoodworking Edgebanding Hot Melt Adhesives
AppearanceWhite Solid
ComponentPUR (Polyurethane)
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt ViscosityAbout 65000cps@120℃(Brookfield-ASTMD3236)
Open TimeAbout 10s@25℃
Usage ScopeEdge Bonding of Wood Materials - Chip Board
Shelf Life6 Months
Package500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel

FEATURE

Stable viscosity under heating at a certain temperature.

Short open time.

High initial bonding strength.

High final bonding strength and no cleaning.

USER GUIDE

The package of PUR-7563A is suitable for various dispensing equipment.

The recommended operating temperature is 120℃~140℃.

It is better to place finished product in a working environment with suitable temperature and humidity to achieve complete curing (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE

Dry, cool, avoid direct sunlight, no more than 35℃.

Previous : Flat Lamination Reactive Polyurethane PUR Hot Melt Glue Heat Resistance Woodworking Next : High Gloss Dtf Powder Digital Transfer Hot Melt Adhesive for Direct Print Cotton
Copyright 2023-2024 - www.globalbiz8.com All Rights Reserved