The Metals sputtering targets are : Aluminum (Al), Antimony (Sb), Barium (Ba), Bismuth (Bi), Cerium (Ce), Chromium (Cr), Copper (Cu), Cadmium (Cd), Dysprosium (Dy), Erbium (Er), Gold (Au), Gadolinium (Gd), Germanium (Ge), Holmium (Ho), Hafnium (Hf), Indium (In), Iridium (Ir), Iron (Fe), Lanthanum (La), Lutetium (Lu), Lead (Pb), Magnesium (Mg), Molybdenum (Mo), Niobium (Nb), Neodymium (Nd), Nickel (Ni), Praseodymium (Pr), Platinum (Pt), Rhenium (Re), Ruthenium (Ru), Scandium (Sc), Silicon (Si), Samarium (Sm), Silver (Ag), Selenium (Se), Tantalum (Ta), Terbium (Tb), Titanium (Ti), Thulium (Tm), Vanadium (V), Tungsten (W), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn).

Purity:From 99% to 99.9999%, Shape: Foil, sheet, wire, rod, tube, powder, ingot.