Features and Benefits

1.Thermal impedance: 0.71°C-in2 /W (25 psi)

2.Electrically isolating

3.65°C phase change compound coated on PEN film

4.Tack-free and scratch-resistant

BERGQUIST Hi-Flow 625 is a film-reinforced phase change material.

The product consists of a thermally conductive 65°C phase change compound coated on PEN film. BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.

The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems.

The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.

BERGQUIST HF625 Typical Applications Include: 1.Spring clip mounted 2. Power semiconductors 3.Power modules

HI FLOW THF 500 Configurations Available: 1.Sheet form, die-cut parts and roll form 2. With or without pressure sensitive adhesive