Bergquist SP900S, SIL PAD 900S, Sil Pad Tsp 1600s

The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. BERGQUIST SP900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD 900S minimizes interfacial thermal resistance and maximizes thermal performance.