hot air BGA rework station

Intelligent heating, fan untrasfer,heating is not powered on. Instrument control,and three independent heating zone,suitable for lead-free process. The first heating zone, the second heating zone heater uses finely heating material,produces the high temperature breeze, the third heating zone uses the far infrared to send the hot plate preheating,prevents the PCB board curve. 8 steps temperature control, that simulates the effect of reflow soldering machine. You can store 10 sets of temperature and time parameter. After the heating finished used the great current capacity constant flow antithetical PCB board to carry on cooling,prevented the PCB board to curve,guarantee welding effect. Hand-held vauum wand sucking BGA, convenient,reliable,durable. Card board with a special tooling for a wide variety of notebook motherboard. Hot air with a variety of dimensions,or according to special nozzle require custom.