Molecular weight: 24.18

97%、99%HS：2850000090

Product features

Hexagonal boron nitride is has good electrical insulation, thermal conductivity, chemical stability, no obvious melting point, heat resistant up to 3000 ℃ in 0.1 MPA nitrogen, in a neutral reduction atmosphere, heat resistant up to 2000 ℃, the nitrogen and argon is used in the temperature can reach 2800 ℃, poor stability in oxygen atmosphere, temperature below 1000 ℃, the theory of density of 2.27 g/cm3, specific gravity: 2.43, hardness is 2 mo type.

The product application

3, can be used as a semiconductor solid phase doping material, anti - oxidation or anti - water grease.

6. Structural materials for atomic reactors, spouts for aircraft and rocket engines, packaging materials to prevent neutron radiation, and thermal shielding materials for aerospace.

9, do a variety of capacitor film aluminum, aluminum tube, display aluminum plating evaporation boat.