Chip type: push type Pixel area: 128 x72 pixels Resolution: 508DPI Sampling accuracy: 10 bit FRR: <1% FAR: <0.002% Recognition time: <300ms ESD: HBM +/-8KV Power consumption sleep mode: <80uA Working temperature: -40℃～85℃ Module surface material: support 210um glass cover Compression times: >100W IBFM adaptive intelligent algorithm can automatically correct identification and support secure payment