Technical Data：
| Breaking Strength at Room Temperature |
≥900Mpa | Fracture Toughness at Room Temperature |
6.0-8.0 Mpa.m1/2 |
| Volume Density | 3.20-3.4g/cm3 | Volume Resistivity at Room Temperature |
1014Ω.cm |
| Relative Dielectric Constant at Room Temperature |
6-7 | Heat Conductivity | 23-25W/（m-k） |
| Thermal Expansion Coefficient | 3.1×10-6/℃ | Hardness | HRA92-94 |
Main Performance Indexes of Silicon Nitride Ceramics:：
| Performance | Reactive Sintering Silicon Nitride |
Normal Pressure Sintering Silicon Nitride |
The Company’s Hot Pressed Sintering Silicon Nitride |
| Volume Density （g/cm3） |
2.21 | 3.15 | 3.2~3.3 |
| Bending Strength（Mpa） | 137.3 | 490.3 | ≥900 |
| Fracture Toughness (Mpa·m1/2) |
2.17 | 4.71 | 6.0~8.0 |
| Hardness (HRA) |
\ | 87.0 | 92.0~94.0 |
| Heat Conductivity Coefficient (W/m·k) |
5.44 | 12.56 | 23~25 |
| Thermal Expansion Coefficient χ10-6 ℃ (RT~1200℃) |
3.2 | 3.2 | 2.95~3 |
