* In Circuit Testing

* X-Ray for BGA TestingEach board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.

1.Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

4.SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement,etc.

PCBA Capability

Items	PCBA capacity
Product name	mobile app controlled elevator drone flight controller board pcb
Assembly details	SMT and Thru-hole, ISO SMT and DIP lines
Testing on products	Testing jig/mold , X-ray Inspection, AOI Test, Functional test
Quantity	Min quantity : 1pcs. Prototype, small order, mass order, all OK
Files needed	PCB : Gerber files(CAM, PCB, PCBDOC)
	Components : Bill of Materials(BOM list)
	Assembly : Pick-N-Place file
PCB Panel Size	Min size : 0.25*0.25 inches(6*6mm)
	Max size : 1200*600mm
Components details	Passive Down to 0201 size
	BGA and VFBGA
	Leadless Chip Carriers/CSP
	Double-sided SMT Assembly
	Fine BGA Pitch to 0.2mm(8mil)
	BGA Repair and Reball
	Part Removal and Replacement
Component package	Cut Tape, Tube, Reels, Loose Parts
PCB+ assembly process	Drilling-----Exposure-----Plating-----Etaching & Stripping----- Punching-----Electrical Testing-----SMT-----Wave Soldering----- Assembling-----ICT-----Function Testing-----Temperature & Humidity

SMT PCB Assembly Capabilities