integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.

＜3s Start-up Time

COIN612 integrates 640x512@12μm wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.

infrared

Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series to be integrated into more terminal products and greatly reduces the cost for customers.

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