Operating Principle of Copper Target
The sputtering process operates based on the ionization of the sputtering gas, typically argon, which creates a plasma that is accelerated towards the target surface. The plasma ionizes the gaseous argon, creating high-energy ions that impact the copper target, causing sputtering. The sputtered material is deposited onto a substrate, creating a uniform and high-purity copper film.
Physical Properties Of Copper Target
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