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Type: |
1A1R |
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Bond: |
Resin or Metal |
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Application: |
Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN （copper epoxy molding ), splitter, sapphire |
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Specification: |
Customized |
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Brand Mark: |
Moresuperhard |
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Trade Terms: |
FOB |
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Packages: |
Hard carton |
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Delivery Time: |
15 workdays by express |
Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance , is used for cutting and slotting of electronic and optical components.
D(mm) |
T(mm) |
U(mm) |
H(mm) |
X(mm) |
4” /100 |
0.5, 0.6, 0.8, 1.0, 1.2, 1.5 |
0.4, 0.5, 0.6, 0.8, 1.0, 1.3. |
20, 31.75 |
5, 10 |
5”/ 125 |
0.5, 0.6, 0.8, 1.0, 1.2, 1.5 |
0.4, 0.5, 0.6, 0.8, 1.0, 1.3 |
20, 31.75 |
5, 10 |
6”/ 150 |
0.6, 0.8, 1.0, 1.2, 1.5, 1.8 |
0.5, 0.6, 0.8, 1.0, 1.3, 1.6 |
20, 31.75 |
5, 7, 10 |
8”/ 200 |
0.8, 1.0, 1.2, 1.5, 1.8 |
0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5. |
20, 31.75 |
5, 7, 10 |
12”/ 300 |
1.0, 1.2, 1.4, 1.5, 1.7, 1.8 |
0.7, 0.9, 1.1, 1.4 |
20, 31.75 |
5, 7, 10 |
16”/ 400 |
1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 |
0.9, 1.2, 1.4, 1.6, 2.0 |
20, 31.75 |
5, 7, 10 |
20”/ 500 |
1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 |
0.9, 1.2, 1.4, 1.6, 2.0 |
20, 31.75 |
5, 7, 10 |
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Other size can be made according to customers’ requirement |
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Detailed Specifications can be customized!
– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish
– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.
– Able to precisely control diamond concentration to achieve cutting quality
– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness
