Our disco diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc. Specifications of Diamond Dicing Blades With Hub Product Specification Available shape 14A1 Working Condition Grinding Type Wet

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