High Tg Glass/Epoxy Tape

Properties

Excellent in wire-bonding workability with excellent hot hardness.

Excellent in adhesion to copper foil or to adhesive agent

Excellent in insulation resistance.

Excellent in chemical resistance

Low temp. Curable (Max. 160C )

Compared with PI film, Excellent in demensional stability with proper stiffness

Applications

IC substrate for Smart cards

IC substrate for BGA, CSP or COB

Small size LCD driver substrate.