General Introduction: Product Functions: F400 a high accuracy printing robot designed for high precision screen printing or stencil printing in SMT industry. Product Features: Support spectrums of PCB sizes from 50mm x 50mm to 450mm x 340mm and PCB thickness from 0.8mm to 6mm. High printing accuracy High positioning accuracy, repeated positioning accuracy ±0.008mm; printing accuracy ±0.015mm. Support glue printing Automatic control improves production efficiency, quality control and cost saving: Automatic stencil positioning Automatic PCB calibration Programmable squeegee pressure Automatic printing Automatic stencil cleaning (dry-type, wet-type and vacuum-type) Adopt company independently developed suspended print head and Programmable pressure adjustment system. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste. Programmable motor controls separation speed and distance among the squeegee, stencil and substrates, to realize multi-method separation. Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning. Upward and downward visual positioning. Built-in image processing system Support 2D, SPC functions Applicable pitches of Components SMT Components such as resistors, capacitors, inductors, diode and triode: 010035, 0201, 0402, 0603, 0805, 1206 and other specifications. IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm ; Printing size:50mm x 50mm ~450 mm x 340 mm PCB Thickness: 0.8mm ~ 6mm FPC Thickness: thickness≦ 0.6 mm (excluding jig) Applicable PCB Types Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products
Specification
The following data is obtained under ambient temperature of 25 ℃ and humidity of 60%
Items | Parameter | ||
Repeat Position Accuracy | ±0.008mm | ||
Printing Accuracy | ±0.015mm | ||
Cycle Time | <8s (Excluding Printing & Cleaning) | ||
Products Changeover | <5Min | ||
Screen Stencil Size/Min | 470mm*370mm | ||
Screen Stencil Size/Max | 737mm*737mm | ||
Screen Stencil Size/Thickness | 20mm ~ 40mm | ||
PCB Size/Min | 50*50mm | ||
PCB Size/Max | 400*340mm | ||
PCB Thickness | 0.6~6mm | ||
PCB Warpage Ratio | <1%(Based on diagonal length) | ||
Platform to Board distance | 13mm(standard configuration),25mm(optional configuration) | ||
Edge to Board rim distance | 3mm | ||
Transport Height | 900±40mm | ||
Transport Direction | Left-Right; Right-Left; Left-Left; Right-Right | ||
Transport Speed | 100-1500mm/sec Programmable | ||
Board Location | Support System | Magnetic pin/Side support block/Flexible automatic pin(optional) | |
Clamping System | Elastic side clamping/Vacuum nozzle/Elastic Z-direction tablet (Optional) | ||
Print head | Programmable motor driven print head/ Integrated motor driven and pneumatic control print head (Optional) | ||
Squeegee Speed | 10~200mm/sec | ||
Squeegee Pressure | 0-15kg programmable (Standard)/ 0~0.5MPa with adjustable pressure reducing meter valve (Optional closed-loop pressure feedback system) | ||
Squeegee Angle | 60°(Standard)/55°/45° | ||
Squeegee Type | Steel squeegee (standard), rubber squeegee, customizable other types of squeegee | ||
Stencil Separation Speed | 0.01~10mm/sec Programmable | ||
Cleaning Method | Dry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods) | ||
Table Adjustment Range | X: ±4mm;Y:±6mm;θ:±2° | ||
Type of Image Fiducial Mark | Standard geometry shape of fiducial mark, bonding pad / stencil apertures | ||
Camera System | Single digital camera with upward/downward vision system | ||
Air Pressure | 4~6Kg/cm2 | ||
Air Consumption | Approx 0.07m3 /min | ||
Control Method | PC Control | ||
Power Supply | AC:220±10%,50/60HZ 1Φ 1.5KW | ||
Machine Dimensions | 1250mm(W)*1450mm(D)*1540(H)mm (excluding height of indicating lighthouse) | ||
Weight | Approx:1100Kg | ||
Operation Temperature | -20°C ~ +45°C | ||
Operation Humidity | 30%~60% |