| Item | PCB Capability |
| Laminate materials | FR4,High TG FR4, Hign Frequency, Alum, FPC |
| Board Thickness | 0.3mm-5.0mm, Flex 0.1-0.25mm |
| Thickness Tolerance | +-10% |
| Number of layers | 1-22L |
| Min Line Width/space | 4mil/4mil |
| Inner Layer Cooper Thickness | 0.5OZ-3OZ |
| Out Layer Copper Thickness | 0.5-4OZ |
| Hole Position Tolerance | +-0.076mm |
| Blind Hole/Buried Plate | YES |
| Surface Finish | HASL, ENIG,Immersion silver,immersion tin, OSP... |
| PCB Outline | Rectangular,Roung,Slots,Cutouts,Complex,Irregular |
| Package | QFN,BGA,SSOP,PLCC,LGA |
| PCB Testing | E-Test, Flying Probe test |
| Acceptable File Formate | Gerber, Auo CAD'S, Pro-E,Ki-CAD |
| Quality Standards | IPC-A-600F and MIL-STD-105D, China GB<4588> |
