Heat-Resistant And Anti-Static Jedec IC Trays With Different Temperatures Can Be Customized For IC Modules

1. Standard Jedec Tray Outline size is 322.6X135.9X7.62mm or 322.6*135.9*12.19mm.

2. The production process is injection molded products.

3. Rich experience and mature design team in the field of injection molding products, providing one-stop services from design to mold to product packaging

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.

The Flat cells in the center area of each tray is designed for automatic equipment to allow the use of vacuum picking up tools. If it is necessary to cancel in special cases, we can also change the design according to your requirements at the beginning of the design.

The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.