Tungsten-Copper is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.
Features
High thermal conductivity
Excellent hermeticity
Excellent size control, surface finish and flatness
Semi-finished or finished (Ni/Au plated) products available
Production information
Type |
Composition |
Properties |
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|
|
element |
Content wt% |
Density |
CTE ppm/K |
TC, W/m·K |
|
Mass density, g/cm3 |
Relative density, %T.D |
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W90Cu |
W Cu |
90±1 balance |
17.0 |
≥99 |
5.6~6.5 |
180~190 |
W85Cu |
W Cu |
85±1 balance |
16.3 |
≥99 |
6.3~7.0 |
190~200 |
W80Cu |
W Cu |
80±1 balance |
15.4 |
≥99 |
7.6~9.1 |
200~220 |
