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| Layer Count & Material |
| Layers | 1-8Layers | Maximum Panel Size | 19.6*31.0 inch |
| Maximum Single Unit Size | 9inch*14inch （limitation is 9inch*23inch） | Minimum Panel Size | 9.0*12.0 inch |
| Board Size Tolerance | ±0.1mm | Maximum Finished Board Thickness | 0.80mm |
| Minimum Finished Board Thickness | 0.05mm |
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| Trace/Line |
| Minimum Line Width for Inner Layers | 3mil | Minimum Line Spacing for Outer Layers | 3.5mil |
| Minimum Line Width for Outer Layers | 3mil | The Copper Thickness for Inner Layers | ≤2OZ |
| Minimum Line Spacing for Inner | 3mil | The Copper Thickness for Outer Layers | ≤3OZ |
| Drilling |
| Minimum Hole Diameter | 0.15mm | Minimum Distance from Hole to Board Outline | 8mil |
| Maximum Hole Diameter | 6.4mm | Minimum Size for Hole Ring | 4mil （Partially 3.2mil） |
| Hole Diameter Tolerance | ±2mil | The Minimum BGA Bonding Pad Design | ≥8mil (7mil is the Limitation) |
| The Distance from Hole to Hole | 10mil | The Minimum SMT Design | ≥7mil |
| Solder Mask |
| SM Bridge Width | ≥4mil | Minimum Width of Legend | 4mil |
| Minimum Size of SM Window | 3mil（Partially 2.5mil） | Minimum Hight of Legend | 23mil |
| The Minimum Distance from SM Window to Other Outline | 3mil |
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| Surface Finished |
| HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F |
| Impedance |
| Whether it is capable of impedance testing | Yes, it capable, it have |
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