Feature/Function:

* Dual-use sputtering and evaporation function, less occupied area, competitive price, stable performance and low maintenance costs;

* Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;

* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;

Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.

Technical Parameters:

Equipment Name: Magnetron Sputtering System

Model: JCP200

Chamber Structure: Vertical top cover structure, bottom pumping system, manual

pneumatic spring pull open type

Chamber Size: Φ210×H310mm

Baking Temperature: Room temperature to 350℃

Sputtering Path: Upward

Rotating Substrate Holder: Φ100mm

Film Thickness Nonuniformity: Within the scope of Φ50mm≤±5.0%

Sputtering Target/Evaporation Electrode: 1 Pc of Φ2 Inches magnetron target, reserved 1 group of evaporation electrode interface

Process Gas: 1-2 Routes gas flow control

Control Method: PLC Control/IPC automatic control(optional)

Occupied Area: (Mainframe) L600×W800×H1700mm

Power: ≥7kW