Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine | Buy Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine from Wuhan Dayan Zhizao Technology Co., Ltd, China

Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine Details

Brand Name

Dayan

Model Number

JD-BBW

Place of Origin

China

Supply Type

OEM Service

Condition

New

Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine Introduce

Range of applications

Laser tin ball welding process:

-No rosin residue, free from cleaning

-The size of the tin ball is fixed to ensure the consistency of the solder joint

Specification of tin ball:

sizeWuhan Dayan Zhizao Technology Co. , Ltd. is a professional supplier of laser tin ball welding systems, providing customized solutions for customers.

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