Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine | Buy Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine from Wuhan Dayan Zhizao Technology Co., Ltd, China

Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine Details

Brand Name

Dayan

Model Number

JD-BBW

Place of Origin

China

Supply Type

OEM Service

Condition

New

Laser Solder Ball Jetting System for Automatic Mobile Phone IC Chip CPU Emmc BGA Reballing Machine Introduce

Range of applications

Laser tin ball welding process:

-No rosin residue, free from cleaning

-The size of the tin ball is fixed to ensure the consistency of the solder joint

Specification of tin ball:

sizeWuhan Dayan Zhizao Technology Co. , Ltd. is a professional supplier of laser tin ball welding systems, providing customized solutions for customers.

Previous : SeaRay Laser Metal Welding Machine SR-W01 Hot Selling with 1000w Next : Mobile App Laser Marking Machine

You May Also Like

Thin Carbon Steel Stainless Steel Metal Tube and Plate Automatic Fiber Laser Cutting Machine

Laser Level

RF Shielded Doors MRI Shielding Hospital Copper Inlay Shielding Door

SDS-05535 0.55mm Diameter 35mm Length Glued Steel Fiber

Auto Robot Vacuum Cleaner for Sale

ISO9001 Stainless Steel Tube Chuck , 3 Jaw Metal Lathe Chuck

Hot Selling 755nm 808nm 1064nm Diode Laser Device Big Spot Size Diode 808 Diode Laser Hair Laser Rem

SopranTitanium 2022 New Sopran Ice/Laser 808 Diode Laser Hair Removal Machine

P Series Laser Cutting Machine Cutting 4mm Brass

Automatic 220V Dress Pressing Machine Touch Screen PLC