| 1 | Layer | 1-20 layers |
| 2 | Material | FR-4(High TG),CEM-1,Aluminum base,CEM-3, FR4 Halogen Free,Polyimide,Rogers,TEFLON |
| 3 | Board thickness | 0.2mm-6mm(normally 1.6mm) |
| 4 | Max.finished board size | 1200*600mm |
| 5 | Min.drilled hole size | 0.1mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Immersion Gold/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask |
| 9 | Copper thickness | 18um-280um(0.5OZ-8OZ)(normally 1OZ) |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Outline Tolerance | ±0.13mm |
| 12 | Impedance control Tolerance | ±10% |
| 13 | Hole tolerance | PTH:±0.075mm,NPTH:±0.05mm |
| 14 | Certificate | UL,ISO9001,ISO14001,SGS |
| 15 | Profiling punching | Routing,V-CUT,Beveling |
| 16 | Production capability | 72,000s.q.m/month |
