Main technical indexes:
1. ultimate vacuum: ≤6.6X10³Pa
2. vacuum acquisition system adopts molecular pump + mechanical pump unit
3. continuous pumping for 30 minutes, the vacuum degree is less than or equal to 8x10³Pa
4. cylindrical sputtering targets can work independently or at the same time
The
5. substrate ≤60mm in diameter, can be heated to ≤700℃, with water cooling, substrate speed adjustable, adjustable target base moment
| Component | Composition and specifications | |
| Vacuum chamber | Number | Single chamber |
| Material | 304 stainless steel | |
| Form | Cylindrical vertical structure | |
| Dimension | Φ300XH250 | |
| Top seal | Fluorine rubber seal | |
| Nozzle | Contains two vacuum gauge interface, several magnetron sputtering target interface, a high vacuum valve interface, a drainage pipe interface, an observation window interface, three valve interface, three interface and operating mechanism of two electrical interface introduction. |
|
| Opening mode | Top cover lifting device without top lifting | |
| Lighting / drying | 1x1000W lighting lamp, 1x1000w halogen lamp drying, drying temperature within 200℃ |
|
| Vacuum pumping systems | main pump | Molecular pump 1pc |
| forepump | 6L rotary vane mechanical pump | |
| backing pump | ||
| valve | High vacuum valve adopts ultrahigh vacuum 1pc, bleed valve adopts ultrahigh vacuum stop valve three |
|
| Pipe / joint | Precision stainless steel tube, composed of bellows, quick unload street and double card sleeve joint |
|
| Vacuum Measuring System | Compound vacuum gauge, gauge adopts all metal bare gauge | |
| Magnetron Sputtering System | Magnetron sputtering source | One or two R60 magnetron sputtering targets |
| Target mounting position | Vacuum chamber plate | |
| Power Supply | DC0.5KW,RF0.5KW each 1pc | |
| target size | Round copper target Φ60x2pcs | |
| Baffle operation | Direct shaft 1pc | |
| Substrate system | Substrate size / quantity | Φ≤60mm，1pc |
| Substrate rotation | autoroatation, speed 0-120/minute | |
| Target base torque | 10cm, is adjustable (±5cm) | |
| Substrate heating | Can be heated below 700℃, with water cooling | |
| temperature control | PID control, the control accuracy ±1℃ | |
| Water cooling system | cooling of target | With a cooling water pipe and no cooling water or insufficient cooling water pressure, the water pressure relay is disconnected and the target power supply is cut off so as to prevent the target from overheating |
| Vacuum cooling system | Molecular pump cooling | |
| Substrate cooling | Cooling water cooling | |
| Gas delivery system | Conveying mode | gas pipeline and the charging valve are passed through the vacuum chamber wall |
| Gas control | MFC mass flow controller | |
| Frame | structure | Aluminum frame |
