Layers | 1-8Layers | Maximum Panel Size | 19.6*31.0 inch |
Maximum Single Unit Size | 9inch*14inch （limitation is 9inch*23inch） | Minimum Panel Size | 9.0*12.0 inch |
Minimum Finished Board Thickness | 0.05mm | Maximum Finished Board Thickness | 0.80mm |
Minimum Line Width for Inner Layers | 3mil | inimum Line Spacing for Inner | 3.5mil |
Minimum Line Width for Outer Layers | 3mil | Minimum Line Spacing for Outer Layers | 3mil |
The Copper Thickness for Inner Layers | ≤2OZ | The Copper Thickness for Outer Layers | ≤3OZ |
Minimum Hole Diameter | 0.15mm | Maximum Hole Diameter | 6.4mm |
Minimum Size for Hole Ring | 4mil （Partially 3.2mil） | Hole Diameter Tolerance | ±2mil |
Minimum Distance from Hole to Board Outline | 8mil | The Distance from Hole to Hole | 10mil |
he Minimum BGA Bonding Pad Design | ≥8mil (7mil is the Limitation) | The Minimum SMT Design | ≥7mil |
SM Bridge Width | ≥4mil | Minimum Size of SM Window | 3mil（Partially 2.5mil |
The Minimum Distance from SM Window to Other Outline | 3mil | ||
Minimum Hight of Legend | 23mil | Minimum Width of Legend | |
Surface Finished | HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F | ||
Impedance | |||
Whether it is capable of impedance testing | Yes, it capable, it have | ||
