GIS DLP Exposure machine for 3D glass patterning, providing high-resolution, high-throughput and high-yield to customers by DLP technology and powerful software. Equipped with stable cooling system, ensured that the interior of equipment is maintained at constant temperature of 22°C to guarantee the stability. Applied the semiconductor photolitho process with “negative photoresist” to BM patterning process, customers are able to transfer high quality patterns to 3D cover glass. This manufacturing technology significantly improve the one-pass yield to over 95% with fine patterns and better rendering.

Advanced Automation Line for 3D Cover Glass

This automation line is used to produce BM patterning process on 3D glass for smart phone;

3D raw glass material input by fully equipped automatic loading machine, followed by plasma cleaner, automatic spraying machine, tunnel oven, DLP exposure machine, developing and washing machine, final goods output by unloading machine;

Up to 30um resolution, over 95% of yield, thinning BM layer that easier for assembly, higher pattern quality and lower cost of ownership for customers;