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Molybdenum Copper Ally Electronical Package Heat Sink
Molybdenum Copper Ally Electronical Package Heat Sink
FOB Price
China
Main Products : heat sink, ceramic base, semiconductor housing base, wafer substrate
Ao zhou road Changsha, Hunan
Molybdenum Copper Ally Electronical Package Heat Sink Details
Place of Origin
China
Supply Type
OEM Service
Condition
New
Molybdenum Copper Ally Electronical Package Heat Sink Introduce

Copper Molybdenum heat sinks

It is a composite made from Mo and Cu, Similar to W-Cu CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo - Cu is much lighter than W – Cu, So that it is more suitable for aeronautic and astronautic and astronautic applications.

Features:

High thermal conductivity due to no sintering additives were used

Excellent hermeticity

Relatively small density

Stampable sheets available(Mo content not more than 75wt.%)

Semi-finished or finished(Ni/Au plated) parts available

Production information

TypeCompositionProperties
DensityCTE,
ppm/K
TC,
W/m.K
elementContent,
wt-%
Mass density,
g/cc
Relative density,
%T.D.
Mo70Cu30Mo
Cu
70±1
balance
9.7≥997.6~7.8190~200
Mo60Cu40Mo
Cu
60±1
balance
9.6≥998.3~8.5200~220
Mo50Cu50Mo
Cu
50±1
balance
9.5≥999.7~9.9220~250

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