1.High quality PCBA.
2.Rosh compliant.
3.Quick leadtime.
4.No MOQ request.
5.Final functional testing.
OEM/ODM/EMS Services for PCBA:
Production capability:
The PCBAs made by us is widely used in the area of home appliances,industrial equipments and LED lighting system etc.
Blank PCB manufacturing capability:
| Item | Type | Standard capability |
| 1 | PCB layer | 1-6layer |
| 2 | PCB process | HASL,Flash gold,Immersion gold |
| 3 | Material | Fr4,CEM-1,MCPCB |
| 4 | copper foil | 0.5oz-5oz |
| 5 | board thickness | 0.3mm-3.8mm |
| 6 | Max work size | 480mmx600mm |
| 7 | Min work size | 20mmx20mm |
| 8 | Min hole size | 0.3mm |
| 9 | Min PTH hole | 0.5mm |
| 10 | Min line width/spacing | 0.1mm |
| 11 | Min copper foil | 350u-450u |
Components sourcing capability:
| Item | Type | Cooperate brand |
| Resistor SMD | 0201,0603,0805,1206,1210 | Fenghua |
| Resistor through hole | Any type | Fenghua |
| Capacitor SMD | 0201,0603,0805,1206,1210 | Fenghua |
| Tant Capacitor SMD | A,B,C,D | NEC |
| Capacitor through hole | Metal film,polyester,electrolytic,tantalum | Fara,Rubycon,Tenta,TPC |
| Diode,transistor | SMD/through hole | NXP,Philips,National,Toshiba,ST,ON |
| LED | SMD 3528,5050/through hole | Seoul,Dominant,Kingbright |
| ICs | SMD/through hole | MIC,Fairchild,ST,TI,Sharp |
| Others | connector,POT,switch,socket,inductor,fuse,transfomer,relay etc. | Competitive brand in China |
Assembly capability:
| Item | Type | Capability |
| SMD | Mini component to 0201 | 300000pcs/day |
| Through hole | Any type | 90000pcs/day |
| Hand soldering | Any type | 45000pcs/day |
| blank board | Max board working size to 1.2m |
PCB assembly Equipment:
A whole PCB assembly system= A SMD production line + A insertion production line + A hand soldering line.
Quality Control:
1.Customers reconfirm the BOM list before components purchasing;
2.Ispect components when components arrived;
3.Samples confirm before mass production.
4.FCT test for final assemly boards.
Requested information for PCB assembly:
1. Gerber file of the blank PCB board.
2. BOM (Bill of material) list and some main components spec. provided if it's possible.
3. Testing methods provided if necessary.
4. Programming files & Programming tool if necessary.
5. Schematic file provided if necessary.
