100% online control of the entire process, minimizing manual intervention and saving labor costs.

Specifications of PTCME302-Chip Module Encapsulation Machine

Functions of PTCME302-Chip Module Encapsulation Machine

Issuing/receiving Unit

2. Loadable inner diameter φ P40mm (without keyway), outer diameter φ 500mm protective belt material tray.

1. Equipped with strip tensioning, forward transmission, and reverse rewinding functions.

Feed Detection Unit

2. Install X/Y sliding table at the bottom of the mechanism for precise adjustment of sensor position.

1. Equipped with 2 sets of adhesive heads suitable for 9.5mm specification strips, each with 16 adhesive nozzles.

4. The gluing head is driven by an X/Y/Z three-axis motion mechanism, with a three-axis motion accuracy of ≤ ± 0.1mm and a sealing thickness accuracy of ≤ ± 0.03mm.

3. The visual positioning system and the three-axis motion mechanism of the gluing unit are linked and controlled to ensure the position accuracy after gluing is ≤ ± 0.1mm.

3. The overall UV lamp can be moved backwards through software control and has the function of flipping backwards by 90 °, making it convenient for U replacement or maintenance.

1. Simultaneously configure 8 length meters.

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