Home
/
Categories
/
Electronic Components & Supplies
/
Electronic Products & Components Processing
/
QFN Lead Frame Strips with Mold Cap
QFN Lead Frame Strips with Mold Cap
FOB Price
Lead Time
Negotiation, by Production Line
Korea (North)
Main Products : IC Packaging, IC Assembly, Dummy Components, chip packages, BGA, Electronic packaging
B922, 201, Songpa-daero, Songpa-Gu, Seoul
QFN Lead Frame Strips with Mold Cap Details
Place of Origin
Korea
QFN Lead Frame Strips with Mold Cap Introduce

Standard Systems can also build Small volume to Medium-Large amount order after prototype.

We can supply BGA substrates with mold encapsulation for blade sawing test and solder ball attach or solder ball placement test QFN lead frames with mold cap are also available.

We provides services with solution that meet our costomer`s budget and size objectives.

Previous : Optical 7.8mm 8.8mm Sapphie/BK7 Windows Next : Durostone Sheet
Copyright 2023-2024 - www.globalbiz8.com All Rights Reserved