Quick Turn HDI Multilayer PCB
Flexible-Rigid PCB
| Layer Count/Technology | 4-20 layers | 4-20layers |
| PCB Thickness Range | 0.5-2.4MM | 0.4-2.4MM |
| Build Up Technology | 1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 | 1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7 |
| Min.Laser Drill Diameter | 110μm | 75μm |
| Laser Techlology | CO2 Direct Drilling（UV/CO2) | CO2 Direct Drilling（UV/CO2) |
| Materials | FR4/FR4 Halogen Reduced | FR4 / Taconic / Rogers / Others on request |
| Class Transition Temperature | 140℃ / 150℃ / 170℃ | 140℃ / 150℃ / 170℃ / 200℃ |
| Standard Glass Cloth | 1027/106 / 1080/2116 / 1501/7628 | 1037/106 / 1080/2116 / 1501/7628 / 1027/ |
| Copper Thickness | 12μm/18μm/35μm/70μm | 9μm/12μm/18μm/35μm/70μm/105μm |
| Copper Plating Holes | 20μm（25μm） | 13μm / 20μm / 25μm |
| Min. Line/ Spacing | 60μm / 60μm | 40μm / 40μm |
| Soldermask Registration | 70μm | 60μm |
| Min. Soldermask Dam | +/-38μmPhoto-imageable） | +/- 25μm（Photo-imageable） |
| Soldermask Color | Green / White / Black / Red / Blue | Green /White / Black / Red / Blue |
| Max. PCB Size | 575mm × 500mm | 575mm × 500mm |
| Production Panel | 609.6mm × 530mm | 609.6mm × 530mm |
| Min. Annular Ring | 125μm | 100μm |
| Smallest Drill | 0.28mm | 0.15mm |
| Smallest Routing Bit | 0.8mm | 0.8mm |
| Surfaces | OSP/Immersion Tin | OSP/Immersion Tin |
| Immersion NI/AU | Immersion NI/AU | |
| Plated Ni/AU | Plated Ni/AU | |
| immersion AG | immersion AG | |
| Scoring | Yes | Yes |
| ID Print | White | White |
