Product Name : Solder Bar & Wire
Application : Soldering electric, electronic and industrial material.
Specifications
|
Product
Standard |
Alloy
symbol |
Chemical Composition & Impurities Allowance (%)
|
Reference
|
|||||||||||
Sn
|
Pb
|
Sb
|
Cu
|
Bi
|
Zn
|
Fe
|
Al
|
As
|
Cd
|
S.T
(°C) |
L.T
(°C) |
Specific Gravity
|
||
RS60
|
60
±1 |
Bal.
|
0.12
~ 0.05 |
0.05
max |
0.10
max |
0.002
max |
0.02
max |
0.002
max |
0.03
max |
0.002
max |
Approx
183 |
Approx
190 |
Approx
8.5 |
|
|
Flux Characteristics
|
||||||||||||||
|
Item
|
AA
|
A
|
B
|
|||||||||||
|
Dryness
|
Powder of choke must be easily removed from any test piece.
|
|||||||||||||
|
Chlorine Content
|
0.01Min
|
0.01~0.05
|
0.05~1.0
|
|||||||||||
Corrosion
|
Copper Plate Corrosion
|
Corrosion level of test piece must not be big compare with counter test piece.
|
||||||||||||
|
Copper Mirror or Copper Plating Plate Corrosion
|
Corrosion of test piece must not be big compared with standard flux.
|
-
|
-
|
|||||||||||
|
Aqueous Solution
Resistance (Ωm) |
1000Min
|
500Min
|
-
|
|||||||||||
|
Isulation Resistance(Ω)
|
1 x 1012 Min
|
1 x 1011 Min
|
1 x 108 Min
|
|||||||||||
|
Voltage permissible tolerance to moisture
|
Ω
|
1 x 1012 Min
|
1 x 1011 Min
|
1 x 108 Min
|
||||||||||
|
Naked Eye
|
Obvious corrosion must not exist on every part of test piece.
|
|||||||||||||
|
The Spreading Rate(%)
|
75Min
|
80Min
|
80Min
|
|||||||||||
|
Solder
|
||||||||||||||
|
Do A Grade of Soft Solder
|
||||||||||||||
|
Measurement and Tolerance(mm)
|
||||||||||||||
|
0.8~5.0
|
± 0.1
|
0.7Max
|
± 0.05
|
|||||||||||
|
Mechanical properties
|
||||||||||||||
|
Zinc Solder(SHC)
|
Soldering lead wire onto zinc sprayed surface of film capacitor. Good dispersion and adherence.
|
|||||||||||||
|
Packing
|
Bobbin
|
0.5 1 5kg
|
||||||||||||
|
According to customer's request
|
||||||||||||||
