PRODUCT DESCRIPTION
Board Thickness | 1.6 mm |
Base Material | Rogers4003C + FR4 |
Copper Thickness | 1OZ |
Min. Line Width/ Spacing | 6mil (0.15mm)/6mil (0.15mm) |
Soldermask | Green |
Silkscreen Color | White |
Surface Finishing | ENIG |
Min.Quantity of Order | No MOQ |
Layer Count | 4 Layer |
Difficulty | RO4003 Rogers Fr4 Mix Laminate Multilayer PCB with Step design |
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.
Dk of 3.38 +/- 0.05
Dissipation factor of 0.0027 at 10 GHz
Low Z-axis coefficient of thermal expansion at 46 ppm/°C
Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication cost
Designed for performance sensitive, high volume applications
Competitively priced
● IPC-4101 Specification for base materials rigid / multi-layer
● IPC-600G Acceptability of Printed Boards / Class 2
● IPC-6011 Generic Performance Specification for Printed Wiring Boards
● IPC-6012B -Qualification and Performance Specification for Rigid Boards/class 2
● IPC6013A- Qualification and Performance Specification for Flexible Printed Boards/class 2
● IPC6016- Qualification and Performance Specification for High Density Interconnect(HDI) Layers or Boards/ class 2
● IPC-SM-840 Qualification and Performance of permanent polymer coatings
● MIL-PFR-55110 Military Performance and Specifications-Tucson
● IPC-6018 Microwave End Product Board Inspection and Test-Tucson
● IPC-TM-650 Test methods manual.
