ROGERS RT/Duroid 6010 High Frequency PCB for Ground Radar Warning Systems
Hi Guys,
Today we’re going to talk about Rogers 6010 PCB.
Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.
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PCB Capability |
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PCB Material: |
Ceramic-PTFE composite |
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Designator: |
RT/duroid 6010LM |
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Dielectric constant: |
10.2 ±0.25 (process) |
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10.7 (design) |
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Layer count: |
1 Layer, 2 Layer |
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Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
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PCB thickness: |
10mil (0.254mm), 25mil (0.635mm) |
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50mil (1.27mm), 75mil (1.90mm) |
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PCB size: |
≤400mm X 500mm |
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Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
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Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, OSP. |
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RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
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Features and Benefits |
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1. High dielectric constant for circuit size reduction |
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2. Low loss. Ideal for operating at X-bank or below |
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3. Low moisture absorption reducing effects of moisture on electrical loss |
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4. Low Z-axis expansion providing reliable PTH in multilayer boards |
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4. Tight DK and thickness control for repeatable circuit performance |
The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.
Appendix: Properties of RT/duroid 6010LM laminates. Thank you for your reading.
| RT/duroid 6010 Typical Value | |||||
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23 ℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/ ℃ | -50 ℃ -170 ℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 10 5 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 10 6 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50 ℃ /7MPa 24hr/150 ℃ /7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50 ℃ 0.050"(1.27mm) thick | ||
