t is excellent for surface protection of substrates such as wafers in semiconductor, backgrinding and dicing processes. Daehyunst is providing special, high-performance tapes according to the diversification and high quality of chips. We develop and supply products to meet the needs of our customers. We are producing tapes that can be applied to backgrinding, wafer dicing, epoxy molding, and packaging dicing during the post-processing of LED chips and semiconductors.
Dicing & GrindingPrevent chip flying during dicing due to the excellent adhesionEasily removed after UV irradiation
Back GrindingWafer surface protection during grinding
Film Assist MoldingEasily removed due the low adhesionPrevent resin bleed, mold flash
Film Assist MoldingPrevent resin bleed, mold flashSilicone & Thermoplastic adhesive available
| Grade | Film Type | Thickness (ใ) | Single/ Double sided | Peel Strength(A) | Peel Strength(B) | Application |
|---|---|---|---|---|---|---|
| ST-8337LT | PI | 35 | Single | 50gf/in | QFN Back Side Tape | |
| ST-PO518UV | PO | 170 | Single | 1500gf/in | 20gf/in | UV Dicing Tape |
| ST-5053BG | PO | 170 | Single | 90gf/in | Wafer Back Grinding Tape | |
| ST-5265AS-DC | PO | 140 | Single | 1600gf/in | 95gf/in | PKG UV Dicing Tape |
| ST-5748MF | PET | 48 | Double | 4gf/in | Mold Release Tape | |
| ST-5741MF(ASG) | PET | 42 | Single | 12gf/in | Mold Release Tape | |
| ST-U100 | PU | 113 | Single | 60gf/in | LED Transfer Tape |
