It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO)、Semiconductors (Si)、Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency、microwave、high power diode packaging and optical communication system.
Features:
High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper
Production information
| Type | Composition | Properties | ||||
| Density | CTE, ppm/K | TC, W/m.K | ||||
| element | Content, wt-% | Mass density, g/cc | Relative density, %T.D. | |||
| W90Cu | W Cu | 90±1 balance | 17.0 | ≥99 | 5.6~6.5 | 190~200 |
| W85Cu | W Cu | 85±1 balance | 16.3 | ≥99 | 6.3~7.0 | 200~210 |
| W80Cu | W Cu | 80±1 balance | 15.4 | ≥99 | 7.6~9.1 | 220~230 |
| W50Cu | W Cu | 50±1 balance | 12.3 | ≥99 | 12.3~12.8 | 230~240 |
