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Shenzhen PCB Muli-layer Printed Circuit Board Manufacturing Technology
Shenzhen PCB Muli-layer Printed Circuit Board Manufacturing Technology
FOB Price
China
Main Products : multi-layer pcb, rigid-flex pcb, consumer electronic bords, Printed circuit board
6th building,Jidali indurstial zone,Gonghe,Shajing street,Baoan district,Shenzhen Guangdong,China Shenzhen, Guangdong
Shenzhen PCB Muli-layer Printed Circuit Board Manufacturing Technology Details
Place of Origin
China
Supply Type
OEM Service
Condition
New
Base Material
Copper
Board Thickness
1.8mm
Copper Thickness
1oz
Number of Layers
12-x-layer
Surface Finishing
glidedfingerandgoldsink
Shenzhen PCB Muli-layer Printed Circuit Board Manufacturing Technology Introduce

Item HLC PCB HDI PCB
Layer Count 1-24 4-16
Board Thickness 0.3-3.4 mm 0.27-3.2 mm
Minimum Dielectric Thickness 0.045 0.03
Max. Panel Size 28.5'' x 24.5'' 24'' x 18.7''
Base Copper Thickness 1/3-6oz 1/3-4oz
Hole-wall Copper Thickness 20-70um 20/18, 25/20um
Outer layer Finished Copper Thickness 1-5oz 1-2oz
Min. Line Width/Space(inner layer) 0.05mm / 2mil 0.05mm / 2mil
Min. Line Width/Space(outer layer) 0.05mm / 2mil 0.05mm / 2mil
Min. Mechanical  Drill Diameter           0.15mm / 6mil 0.15mm / 6mil
Min. Laser Hole Diameter 0.075mm / 3mil 0.075mm / 3mil
Max. Aspect ratio(PTH) 14:1 14:1
Surface Treatment HASL-LF,HASL,ENIG, Immersion Tin, OSP,  Immersion Silver, Gold Finger HASL-LF,HASL,ENIG, Immersion Tin, OSP,  Immersion Silver, Gold Finger

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