Silicone thermal pad
Introduction
XK-R Series silicone rubber thermal gap filler is a kind of silicon rubber-based gap filling material which is highly compressed with high heat-conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/m.K. This kind of materials is aiming at offering super heat-conducting property and maintains the cost efficiency of customers as well.
Features
Un-reinforced construction for additional compliancy
Medium compliancy and conformability
High thermal performance, cost-effective solution
Easy to USE ( 0.1~0.5mm )
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Aerospace.
Military.
Medical devices.
Industrial controls.
| unit | XK-R10 | XK-R15 | XK-R20 | XK-R30 | XK-R50 | Method | |
| Reinforcement Carrier | NA | NA | NA | NA | Gray | ||
| Thickness | mm | 0.2~0.5 | 0.2~0.5 | 0.2~0.5 | 0.2~0.5 | 0.2~0.5 | ASTM D374 |
| Specific Gravity | g/cm3 | 2.3 | 2.5 | 2.8 | 3 | 3.2 | ASTM D792 |
| Hardness | Shore A | 15 | 20 | 30 | 50 | 60 | ASTM D2240 |
| Thermal Conductivity | W/mK | 1 | 1.5 | 2 | 3 | 4.8 | HOT DISK |
| Volume Resistivity | Ωcm | >1013 | >1013 | >1013 | >1013 | >1013 | ASTM D257 |
| Breakdown Voltage | KV/mm | 16 | 15 | 15 | 15 | 13 | ASTM D149 |
| Dielectric Constant | 1 | 5 | 6.5 | 6.5 | 7 | 8 | ASTM D150 |
| Application temperature | โ | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | |
| Tensile strength | psi | >1000 | 100 | 90 | 80 | 60 | ASTM D149 |
| Elongation | % | 30 | 100 | 100 | 80 | 40 | ASTM D149 |
| Siloxane Volatiles D4~D20 | % | <0.01 | <0.01 | <0.01 | <0.01 | <0.01 | GC-FID |
| Flammability | UL94 | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
