Features

High thermal performance

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Applications

Automotive electronics

Comsumer electronics

Telecommunications

Computer and peripherals

Description

XK-G20 is a dispensable, high thermal performance, one-part thermal gel. It is designed to eliminate hand assembly time consuming, decreasing installation cost, it requires no curing. This material can fill intrcate voids and gaps under low pressure, providing low thermal impedance.