http://specrezinatehnika.pulscen.by

At present two-component caulking compounds of ETCM line are produced on the silicone basis.

The main function of compound is providing heat removal from the heating source and hermetic sealing from environment. Compound can be used as a sticker with good adhesion properties with such substances as glass, steel, aluminum and a number of polymers, when adherend surfaces are preprocessed (i.e. creating fine irregularities and SS4155 underlayer application). Adhesive ability of the compound increases (if it is in squeezed state), when temperature is above 150-180°С. Compound is intended for capsulation and hermetization of electronic circuits and microassemblies by means of complete or partial potting; Stimulates effective heat removal from heating elements and microassemblies; Possesses high elasticity properties, chemical inertness and good adhesion properties with metals; Is prone to room temperature polymerization (compound pot-life is 20-40 min.); Unlimited priming layer thickness; No emission of harmful substances during application; Color spectrum: from light grey to black; Modifications supplied: ETCM-1, ETCM-2, ETCM-3, ETCM-4, ETCM-5. In certain temperature conditions (up to 200 °С) strength, dielectric properties and insulativity of the material are invariable. Dielectric capacitivity ? and loss-angle tangent tg ? are low-sensitive to frequency variation. So the material can be used in radio-frequency engineering. In cases with increase of frequency from 100 to 10 Hz, tg ? changes from 3.0*10, if ? = const Depending on the nature, quantity and disperse structure of a ceramic filler, ETCM compounds with different degree of heat conductivity and viscosity are produced. Dynamic Brookfield viscosity at a temperature +23° С is from 0.80 to 18.0 Pa*s. (800-18000 mPa*s) depending on the compound grade. It is one of critical characteristics to choose a certain kind of compound and application technology.

Compounds have high penetrating power, small value of shrinkage and high elasticity, which ensure integrity of components and solder bonds in use.

The following kinds of caulking heat-conducting compounds are manufactured by Timosha Ltd:

(ТУ BY 690402772.001-2007)

Compounds with other technical characteristics can be produced.

DELIVERY: 2 kinds of components: А – ceramics-polymeric composition, В – catalyst, C - sublayer.

APPLICATION INSTRUCTIONS A and B components of ETCM compounds are mixed immediately before use in the following ratio: 2.0-15 mass fractions of component B are added to 100 mass fractions of component A. Reducing the content of component B (catalyst-hardener) within the prescribed limits increases ETCM material lifetime. Storage for more than 30 days from the date of manufacture may alter lifetime of the compound due to partial degradation of catalytic properties of component B. Such cases require preliminary checking and correcting lifetime. Component A must be thoroughly stirred in original manufacturer’s container before use. Sediment and pigment spots on the surface are not considered a defect. Sediments and pigment spots are to disappear after further mixing. To get necessary viscosity (consistency) component A can be mixed with gasoline solvent БР-2 ТУ 38.401-67-108 or НЕФРАС-С2-80/120 according to the manufacturer’s standard specifications in the ratio of no more than 3 mass portions of solvent for 100 mass portions of component A. A and B components are mixed by stirring thoroughly for at least 1-2 minutes. Compounds must be applied in a way preventing introduction of air bubbles, dust particles or other contaminating impurities into the material in the course of the molding process. Before using ETCM compounds, surfaces are thoroughly cleaned from dust, mud and other dirt with a hairbrush, tissue towels or by compressed air blow-off. Surfaces must be degreased and freed from moisture, traces of mineral oils, fat stains and other contaminations by wiping with tissue soaked in gasoline solvent БР-2, petroleum solvent НЕФРАС-С2-80/120 or isopropyl alcohol ТУ 2632-015-11291058. After processing with solvent the surfaces are wiped dry with clean dry tissue. After that the degreasing process is repeated by following the same procedure. The surfaces are covered with compound using a putty knife, syringe, pressure pump or other priming devices of different kinds. Predefined cleavage strength of adhesive bond between compound and surfaces is achieved by treatment of surfaces in accordance with ГОСТ 21981. Adhesive properties of ETCM compounds are not standardized for application of compounds to surfaces of other polymeric or ceramic products. In such cases adhesiveness of ETCM compounds is discussed with a customer or determined independently by a client. Adhesion strength between ETCM compounds and surface can be increased by coating precleaned surface with a sublayer (primer) П-11 or П-12Э ТУ 38.103-04-06-90, SS4120, SS4155 produced by GE Silicones; Ambersil Primer №3 produced by Ambersil Silicones; Dow Corning 1200 RTV Prime Coat produced by Dow Corning. It must be taken into consideration that compounds fully develop their adhesive properties within 2-14 days of polymerization. To achieve good quality of coating, before end of pot-life polymerization of ETCM is performed preferentially at room temperature, and full polymerization is performed at temperatures from 15°C to 70°C. Compounds are applied by fully or partially molding a part or coating its surface with a layer of thermally conductive insulation or hermetic sealing from external environment. Thickness of compound layer is normally 0.3-2.0 mm, with linear shrinkage not exceeding 0.1-1.5%. Due to residual elasticity and minimal shrinkage even highly filled ETCM compounds do not generate residual voltage after polymerization, thus making it possible to avoid mechanical damage to electronic circuits. Thus, reliable sealing from environment, additional electrical insulation, high resistance to vibration strain and impact load and effective heat removal from all the elements of the board simultaneously through the compound to the product case and to environment are guaranteed by complete sealing of cases. After ETCM compounds application sealed items mending is possible. Because of elasticity and comparatively low mechanical strength, compound layer can be easily unsealed with a screwdriver or a putty knife, or can be cut with a knife. Then unsealed places and repaired parts are remolded with compound again (use compound of the same grade) with guaranteed adhesion to the preceding layer. SAFETY MEASURES ETCM compounds are fire-safe, blastproof and water-resistant. By severity of exposure to human body they belong to category 4 according to ГОСТ 12.1.007. In case of eye contact rinse your eyes in plenty of water. Clean affected areas of skin with solvent, gasoline or isopropyl alcohol and then wash with soap. Repeated contact can lead to dry and chapped skin. MANUFACTURER'S WARRANTY The manufacturer guarantees ETCM compounds compliance with the requirements, when the conditions of shipment, storage and usage are fulfilled. Keeping time of A, B and C ETCM compounds in the closed original container of manufacturer is 3 months from the date of manufacture. After the expiration date ETCM compounds are tested for compliance with the requirements before every usage. In the case of compliance, ETCM compounds can be used according to their intended purpose. Complaints and quality claims are receivable when products are returned in original manufacturer’s container with the copies of accompanying forms for the received products (consignation note, quality certificate).