Main Products : IC Packaging, IC Assembly, Dummy Components, chip packages, BGA, Electronic packaging
B922, 201, Songpa-daero, Songpa-Gu, Seoul
TSOP(I). Thin Small Outline Details
Place of Origin
Korea
TSOP(I). Thin Small Outline Introduce
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( Dummy Component;Mechanical IC )
TSOP(I) / Thin Small Outline (Type I)
TSOP(I) :
Body Size : Smallest 8x11.8mm, Largest : 12mmx18.4mm
Body Thickness :1.0mm
Lead Count : 28~48
Lead Pitch : 0.5mm
Solder Plated : Sn85/Pb15,Sn100, Sn98/Cu2.0
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