Semicorex SiC Wafer Boat for Semiconductor Process, the ultimate solution for wafer handling and protection in semiconductor manufacturing. Our wafer boat for semiconductor process is made from high-quality silicon carbide, which have good resistance to corrosion and excellent resistance to high temperatures and thermal shock. Advanced ceramics deliver excellent thermal resistance and plasma durability while mitigating particles and contaminants for high-capacity wafer carriers.
Parameters of Wafer Boat for Semiconductor Process
Technical Properties | ||||
Index | Unit | Value | ||
Material Name | Reaction Sintered Silicon Carbide | Pressureless Sintered Silicon Carbide | Recrystallized Silicon Carbide | |
Composition | RBSiC | SSiC | R-SiC | |
Bulk Density | g/cm3 | 3 | 3.15 ± 0.03 | 2.60-2.70 |
Flexural Strength | MPa (kpsi) | 338(49) | 380(55) | 80-90 (20°C) 90-100(1400°C) |
Compressive Strength | MPa (kpsi) | 1120(158) | 3970(560) | > 600 |
Hardness | Knoop | 2700 | 2800 | / |
Breaking Tenacity | MPa m1/2 | 4.5 | 4 | / |
Thermal Conductivity | W/m.k | 95 | 120 | 23 |
Coefficient of Thermal Expansion | 10-6.1/°C | 5 | 4 | 4.7 |
Specific Heat | Joule/g 0k | 0.8 | 0.67 | / |
Max temperature in air | ℃ | 1200 | 1500 | 1600 |
Elastic Modulus | Gpa | 360 | 410 | 240 |
Features of Wafer Boat for Semiconductor Process
Superior heat resistance & thermal uniformity
Fine SiC crystal coated for a smooth surface
High durability against chemical cleaning
Material is designed so that cracks and delamination do not occur.
